Brief introduction
model | HongJin-H1851 |
| Specification | 30g/branch |
| characteristic | HongJin H1851 is a one-component epoxy resin adhesive with good flow and workability. At the same time, the product can form excellent bonds between many different types of materials. At the same time, it is a high-temperature-resistant glue that can pass reflow soldering. It can still maintain a good bonding effect when it passes through 260-degree reflow soldering, and its waterproof level can exceed level 4. |
| Applicable Products | Automotive connectors, mobile phone connectors and various products that require reflow soldering |
Technical parameter
Attributes | magnitude |
type | epoxy glue |
viscosity（at 25°） | 6300±1500 (mPa·s) |
density（g/cm3） | 1.5±0.20 |
hardness（Shaw BrothersD） | 80+/-10 |
Shear force（MPa）（Fe/Fe） | 4 Min |
water absorption | <1.5% |
Dielectric constant（1MHz） | 2.8 |
surface resistance（Ω） | 1.5×1016 |
Operation time（After opening） | 12H |
Precautions
1、Please store glue at -20 degrees.
2、Warm up the glue at room temperature for 2 hours before use.
3、Before using glue, use it in small quantities to avoid massive problems.
4、Before bonding, the bonding surface must be kept clean and free from water, oil, rust, etc. Better after sanding.
5、Baking after dispensing, please strictly follow the conditions recommended in the specification
Landline ：0755-28307837
Mail ：sales@szhjtec.com
contact ：吳先生 18688927121
王先生 13332958891
address ：深圳市龍崗區坪地街道教育北路49號5B棟501
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